Rajiv Mongia and Intel’s thermal team are pushing boundaries to keep the heat off Moore’s Law and big AI chips that are getting bigger and more powerful. Rajiv, a senior principal engineer in packaging technology development, shares the basic steps and new technologies to advance the state-of-the-art. https://newsroom.intel.com/intel-foundry/burning-buildings-pave-the-way-to-advances-in-ai
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